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| AG103 Product Features * * * * * * * * 50 - 870 MHz 13 dB Gain 3 dB Noise Figure >+36 dBm OIP3 +20 dBm P1dB Single +5 Bias Supply Internally matched to 50 Lead-free/Green/RoHScompliant SOT-89 Package * MTTF > 1000 years The Communications Edge TM Product Information High Dynamic Range Gain Block Product Description The AG103 is a general-purpose gain block that offers good dynamic range and low noise figure in a low-cost surfacemount package. The combination of high OIP3 and tight gain variation window makes it attractive for a multitude of applications. The device combines dependable performance with superb quality to maintain MTTF values exceeding 1000 years at mounting temperatures of +85C and is available in both the standard SOT-89 package and the environmentally-friendly lead-free/green/RoHS-compliant and green SOT-89 package. All devices are 100% RF & DC tested. The AG103 uses a high reliability GaAs MMIC technology and only requires DC-blocking and bypass capacitors, and an inductive RF choke for operation. Internal matching provides a 50 ohm input / output impedance minimizing the number of required external components. The AG103 GaAs MMIC amplifier is well suited for wireless infrastructure such as NMT-450, homeland security, and 2nd generation mobile infrastructure utilizing the cellular band. In addition, the amplifier can be used for applications in various IF frequency bands. Functional Diagram GND 4 1 RF IN 2 GND 3 RF OUT Function Input Output/Bias Ground Pin No. 1 3 2, 4 Applications * * * * Mobile Infrastructure CATV / DBS Defense / Homeland Security NMT-450 Infrastructure Specifications (1) Parameter Operational Bandwidth Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 Noise Figure Operating Current Range Supply Voltage Units MHz MHz dB dB dB dBm dBm dB mA V Min 50 12 Typ 800 12.9 10 20 +20 >+36 2.9 150 +5 Max 870 14 Comment See note 2 +33 120 Pout = +5 dBm/tone, 10 MHz spacing. See note 2 180 1. Test conditions unless otherwise noted: T = 25 C, 50 system. 2. S11 and Noise Figure can be improved using an optional input matching network (typically just a series inductor). Absolute Maximum Rating Parameter Operating Case Temperature Storage Temperature DC Voltage RF Input Power (continuous) Junction Temperature -40 to +85 C -55 to +150 C +6 V +10 dBm +220 C Ordering Information Part No. AG103 AG103-G AG103-PCB Rating Description GaAs MMIC Gain Block (leaded SOT-89 Pkg) GaAs MMIC Gain Block (lead-free/green/RoHS-compliant SOT-89 Pkg) 200 - 600 MHz Fully Assembled Application Circuit Specifications and information are subject to change without notice. Operation of this device above any of these parameters may cause permanent damage. WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com September 2004 AG103 16 The Communications Edge TM Product Information High Dynamic Range Gain Block Typical Device Data S-Parameters (VDS = +5 V, IDS = 150 mA, T = 25C, unmatched 50 ohm system) Gain 0 Return Loss 14 -10 12 Return Loss (dB) Gain (dB) -20 10 8 -30 DB(|S[2,1]|) 6 0 200 400 600 Frequency (MHz) 800 1000 -40 0 DB(|S[1,1]|) 200 DB(|S[2,2]|) 400 600 Frequency (MHz) 800 1000 The device can be used as a gain block with no input or output matching. For optimal input return loss and noise figure performance, the amplifier can be slightly tuned for the frequency of operation as shown in the reference designs in this datasheet. S-Parameters (VDS = +5 V, IDS = 150 mA, T = 25C, calibrated to device leads) Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) 50 100 150 200 250 300 350 400 450 500 550 600 650 700 750 800 850 900 -11.30 -12.11 -12.46 -12.29 -12.35 -12.16 -12.14 -11.95 -11.88 -11.73 -11.60 -11.48 -11.26 -11.08 -10.90 -10.73 -10.51 -10.34 -30.04 -24.59 -25.65 -29.97 -32.81 -38.15 -42.37 -47.75 -52.03 -57.01 -61.03 -66.17 -70.02 -74.52 -79.00 -83.40 -87.42 -91.85 14.35 14.17 14.13 14.10 14.07 14.06 14.02 14.01 13.98 13.91 13.85 13.73 13.76 13.72 13.68 13.62 13.57 13.47 170.13 171.02 169.71 167.82 165.49 163.30 160.54 158.38 155.78 153.04 150.70 148.73 146.23 144.01 141.28 138.73 136.01 133.71 -20.20 -20.12 -20.08 -20.05 -19.99 -19.99 -20.01 -19.99 -20.01 -19.97 -19.95 -20.00 -20.03 -20.01 -19.93 -19.95 -19.94 -19.96 8.20 3.18 1.39 -0.31 -1.51 -2.59 -3.37 -4.74 -5.79 -6.12 -7.43 -8.03 -9.00 -9.46 -10.57 -11.34 -12.38 -12.95 -19.64 -22.19 -22.73 -23.12 -22.90 -23.03 -23.03 -22.80 -22.87 -22.90 -22.68 -22.48 -22.64 -22.19 -22.38 -22.12 -21.94 -21.78 -120.38 -142.79 -155.71 -160.90 -166.97 -167.62 -172.30 -173.68 -176.13 -176.83 179.96 178.91 177.09 176.83 175.26 173.64 172.78 171.76 Specifications and information are subject to change without notice. WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com September 2004 AG103 Frequency The Communications Edge TM Product Information High Dynamic Range Gain Block Application Circuit: 200 - 600 MHz (AG103-PCB) Typical Performance 450 MHz S21 - Gain 13.5 dB S11 -23 dB S22 -14 dB Output P1dB +21 dBm Output IP3 +36 dBm Noise Figure 2.7 dB Bias +5 V @ 150 mA 15 DB(|S[1,1]|) (R) DB(|S[2,1]|) (L) DB(|S[2,2]|) (R) 0 14 -5 S21 (dB) 13 -10 12 -15 11 -20 10 0 100 200 300 400 500 Frequency (MHz) 600 700 800 -25 +5 V CAP ID=C5 C=10000 pF PORT P=1 Z=50 Ohm IND ID=L1 L=12 nH SUBCKT ID=S1 NET="AG103" IND ID=L2 L=390 nH size 0805 S11, S22 (dB) PORT P=2 Z=50 Ohm CAP ID=C1 C= 1000 pF CAP ID=C4 C=1000 pF Circuit Board Material: .014" FR-4, 4 layers, .062" total thickness Notes: 1. The amplifier should be connected directly to a +5 V regulator; no dropping resistor is required. 2. If no DC signal is present at the input, C1 can be removed. The input is internally grounded in the amplifier. 3. C2, C3, C5, & R1 are not used in the circuit. R2 is shorted across with 0 in the circuit. These placeholders shown in the silkscreen are for applications with other devices. Reference Design: 70 MHz +5 V CAP ID=C5 C=1e4 pF Reference Design: 900 MHz +5 V CAP ID=C5 C=10000 pF PORT P=1 Z=50 Ohm SUBCKT ID=S1 NET="AG103" IND ID=L2 L=270 nH PORT P=2 Z=50 Ohm PORT P=1 Z=50 Ohm SUBCKT ID=S1 NET="AG103" IND ID=L2 L=100 nH PORT P=2 Z=50 Ohm CAP ID=C1 C=56 pF IND ID=L3 L=150 nH CAP ID=C4 C=1000 pF CAP ID=C1 C=100 pF IND ID=L3 L=15 nH CAP ID=C4 C=100 pF 15 DB(|S[1,1]|) * (R) DB(|S[2,1]|) * (L) DB(|S[2,2]|) (R) 0 15 DB(|S[1,1]|) * (R) DB(|S[2,1]|) * (L) DB(|S[2,2]|) * (R) 0 14 -5 14 -5 S11, S22 (dB) S21 (dB) S21 (dB) 13 -10 13 -10 12 -15 12 -15 11 -20 11 -20 10 50 100 150 Frequency (MHz) 200 250 -25 10 600 700 800 900 1000 Frequency (MHz) 1100 -25 1200 Specifications and information are subject to change without notice. WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com September 2004 S11, S22 (dB) AG103 The Communications Edge TM Product Information High Dynamic Range Gain Block AG103 (SOT-89 Package) Mechanical Information This package may contain lead-bearing materials. The plating material on the leads is SnPb. Outline Drawing Product Marking The AG103 will be marked with an "AG103" designator. An alphanumeric lot code ("XXXX-X") is also marked below the part designator on the top surface of the package. Tape and reel specifications for this part are located on the website in the "Application Notes" section. MSL / ESD Rating ESD Rating: Value: Test: Standard: ESD Rating: Value: Test: Standard: Class 1B Passes 500V to <1000V Human Body Model (HBM) JEDEC Standard JESD22-A114 Class IV Passes 1000V to <2000V Charged Device Model (CDM) JEDEC Standard JESD22-C101 Land Pattern MSL Rating: Level 3 at +235 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135") diameter drill and have a final plated thru diameter of .25 mm (.010"). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Thermal Specifications Parameter Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) MTTF vs. GND Tab Temperature 1000 -40 to +85C 59 C / W 129 C M T T F (m illio n h rs ) Rating 100 10 1. The thermal resistance is referenced from the hottest part of the junction to the ground tab (pin 4). 2. This corresponds to the typical biasing condition of +5V, 150 mA at an 85C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 160 C. 1 60 70 80 90 100 Tab Temperature (C) 110 Specifications and information are subject to change without notice. WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com September 2004 AG103 The Communications Edge TM Product Information High Dynamic Range Gain Block AG103-G (Green / Lead-free SOT-89 Package) Mechanical Information This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260C reflow temperature) and leaded (maximum 245C reflow temperature) soldering processes. The plating material on the leads is NiPdAu. Outline Drawing Product Marking The AG103-G will be marked with "103G" designator. An alphanumeric code ("XXXX-X") is also marked below part designator on the top surface of package. an lot the the Tape and reel specifications for this part are located on the website in the "Application Notes" section. MSL / ESD Rating Land Pattern ESD Rating: Value: Test: Standard: ESD Rating: Value: Test: Standard: Class 1B Passes 500V to <1000V Human Body Model (HBM) JEDEC Standard JESD22-A114 Class IV Passes 1000V to <2000V Charged Device Model (CDM) JEDEC Standard JESD22-C101 MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135") diameter drill and have a final plated thru diameter of .25 mm (.010"). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Thermal Specifications Parameter Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) MTTF vs. GND Tab Temperature 1000 -40 to +85C 59 C / W 129 C M T T F (m illio n h rs ) Rating 100 10 1. The thermal resistance is referenced from the hottest part of the junction to the ground tab (pin 4). 2. This corresponds to the typical biasing condition of +5V, 150 mA at an 85C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 160 C. 1 60 70 80 90 100 Tab Temperature (C) 110 Specifications and information are subject to change without notice. WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com September 2004 |
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